photonixFAB consortium
The photonixFAB consortium is made up of major public and private enterprises, plus highly respected research institutes – all focusing on the development and production of next-generation silicon photonics.
Covering the entire value chain
The photonixFAB partners are covering the entire photonics value chain. These high-profile partners include technology and manufacturing service providers X-FAB, LIGENTEC, SMART Photonics, PHIX Photonics Assembly and Luceda Photonics plus application developers Nokia, NVIDIA, Aryballe and PhotonFirst, as well as the major research organizations CEA-Leti and IMEC.
Aryballe
Founded in 2014, Aryballe is a Grenoble-based start-up with subsidiaries in the US and South Korea, and about 20 employees. Aryballe combines biochemical sensors, advanced optics, and machine learning in a single objective solution to collect, display and analyze odor data so companies can make better decisions.
Aryballe’s products are silicon photonics-based sensors. Biosensors are grafted to silicon photonics offering a robust, reliable solution for capturing odor data. Our software provides easy-to-use protocol and analysis tools that enable users in R&D, quality and manufacturing to integrate digital odor data into their decision-making process. We currently serve the flavor & fragrances, food, cosmetics and automotive industries, with a growing interest in health and environmental applications.
Contribution to photonixFAB
Within the photonixFAB project, Aryballe will be responsible for the validation of SiN technology with Loca-S modules. This oxide opening step is key to enabling interaction with the VOC (volatile organic compounds). The company will build an olfaction sensor demonstrator using this SiN technology.
Aryballe also develops and improves its own functionalization pilot line and is open to functionalization services for external customers with sensing applications.
CEA-Leti
CEA-Leti (Laboratoire d'électronique des technologies de l'information) is a research institute for electronics and information technologies, based in Grenoble, France. It is one of the world's largest organizations for applied research in microelectronics and nanotechnology.
The French research organization is a global leader in miniaturization technologies enabling smart, energy-efficient and secure technologies solutions for industry. Activities of the Optics and Photonics division cover most of industrial markets for photonics: imaging – data communications – environmental and 3D sensors – displays.
Contribution to photonixFAB
As part of photonixFAB CEA-Leti will contribute to the setting up of an industrial pilot line for wafer level manufacturing and testing of SiN-based PICs with its expertise and experience.
CEA will support technological maturity growth and performance improvement of Ligentec’s SiN platform through engineering and derisking activities to pave the way for volume manufacturing at X-FAB. Another focus is on the heterogeneous integration of SiGe and lithium niobate (LNO) on SiN PICs at wafer-level.
CEA will enable the process integration for SiGe photodiodes on Ligentec’s SiN platform via direct bonding of an SOI wafer and Ge epitaxy.
Moreover, CEA will explore the integration of LNO on Ligentec’s SiN platform. We will develop LNO bonding and patterning processes, to eventually manufacture medium to high-speed modulators designed in collaboration with Ligentec.
imec
Imec is an independent world leader in nanoelectronics R&D and digital technologies, driving 40 years of microchip innovation. Our top talent, unique infrastructure, and worldwide partner network guarantee that we achieve nanotech breakthroughs that are advancing chips to be smaller, faster, more affordable, and more sustainable. With 5,500+ talented employees from more than 95 nationalities, we bridge the gap between academia and industry, accelerating the transfer of knowledge and technology from the research lab to the market.
Our seamless fusion of cutting-edge microchip technology with profound data and AI knowledge enables deep-tech innovation to tackle global challenges. Imec’s innovations serve as the bedrock of many new applications impacting health, mobility, energy, agrifood, industry 5.0, and telecom. Our open innovation network gathers the global nanoelectronics value chain, from system companies to chip manufacturers, material and equipment suppliers, design houses, etc. Together, we're defining the industry’s next steps for a better life through technology leadership and impactful solutions.
Contribution to photonixFAB
Four imec groups are contributing to the photonixFAB project with a Silicon-on-Insulator (SOI) technology-based photonics platform, micro transfer printing (µTP) for heterogeneous integration, device design, and prototyping services.
Imec has developed a silicon photonics platform in its 200mm pilot line that has already been adopted by end users. Within the photonixFAB project this technology will be transferred to X-FAB. Imec will leverage its experience in providing silicon photonics fabrication services to assist X-FAB in developing the necessary processes by providing training and workshops to transfer the existing know-how.
Imec has long experience on the development of µTP for photonic applications ranging from III-V design (now in collaborative effort with SMART), over making print-ready devices, to the actual printing and post-processing. Within photonixFAB imec will establish an R&D pilot-line at imec for µTP and will transfer µTP know-how towards X-FAB’s industrial pilot line.
As part of the photonixFAB project six application-driven demonstrators will be developed. Imec will coordinate the four silicon photonics demonstrators amongst the various partners. Furthermore, imec will design the Photonic IC (PIC) for a coherent demonstrator and will design and source some of the electronics chips. Imec will also process some of the silicon photonics demonstrator wafers.
Imec will set up the pilot line prototyping services offering for SOI-based PICs for the SMEs and academics. This will include early technology access and participation in multi-project wafer (MPW) programs. Furthermore, training activities will be coordinated on the different aspects of imec technologies, both for the internal project partners and for users of the technology platforms.
LIGENTEC
LIGENTEC supplies application specific Photonic Integrated Circuits (PICs) to customers in high-tech markets such as quantum computing, advanced computing, communication, autonomous driving, space and biosensors. LIGENTEC’s proprietary, patented and fully CMOS compatible technology, originally developed at the Federal Institute of Technology in Lausanne (EPFL), provides PICs at better performance than today’s state of the art, on top of which active components can be integrated to enable even more on-chip functionality. It essentially combines the benefits of known, low loss material such as glass with the benefits of silicon photonics and addresses with its low loss and short production cycle the main challenges of integrated photonics today.
LIGENTEC offers a seamless path from R&D to volume, supported by its low entry barrier MPW services, custom PIC developments and high-volume production in a 200mm, IATF 16949 certified CMOS foundry. ISO 9001:2015 certified LIGENTEC is based in Lausanne, Switzerland and Corbeil-Essonnes, Île-de-France, France.
Contribution to photonixFAB
In the project, LIGENTEC Switzerland is responsible for designing all relevant components, to quantify process changes, performance metrics and application-specific chip-level testing for both the SiN base technology and the SiN technology interfacing with the heterogeneously integrated components. Moreover, it leads the customer support and project management for the SiN demonstrators; the exploitation plan for the SiN-based products; and the training associated with the SiN technology modules. LIGENTEC France coordinates the development and installation of all relevant SiN process modules at the industrial line of X-FAB and is responsible for data gathering through extensive wafer-level characterization of the new modules and components.
Luceda
Luceda Photonics is a leading provider of photonic integrated circuit (PIC) design software and services headquartered in Dendermonde/Belgium. Luceda Photonics allows photonic IC designers to enjoy the same power as electronic IC designers. Luceda Photonics’ PIC design software, The Luceda Photonics Design Platform, enables designers to design, simulate, and PICs and empowers photonic designers to quickly achieve their tape-out, getting their designs right the first time. The company leverages more than 50 years of photonic experience to help its customers create manufacturable designs worldwide and supports close to 30 PDKs from over 20 fabs. Luceda Photonics is active in various application areas, such as the data & telecom market, lidar for self-driving cars, quantum computing, sensing and biosensing, and more.
Contribution to photonixFAB
Within the photonixFAB project, Luceda plays a key role in creating mature process design kits for silicon (SOI) and silicon nitride (SiN) photonic IC technologies, enabling the design for heterogenous integration of InP chiplets and electro-optical materials, reducing the cost of packaging by introducing assembly design kits that incorporate packaging rules and electro-optical interfaces, and increasing first-time-right design by further automating photonic IC design implementation with a schematic-assisted design flow, placement and routing automation and simulation.
NOKIA
NOKIA is a global corporation active in telecommunication and information technology markets. Headquartered in Finland, NOKIA has offices and labs in more than 100 countries.
The mission of NOKIA Italy Advanced Optics Lab, located in Vimercate, is to develop Photonic Integrated Circuits (PICs) as differentiating assets for NOKIA OPTICS Subsystems Product range. Having 1100 employees, of which 30% are busy within R&D, Nokia Italy supports wireless and optical fiber communication product development with expertise in HW/SW design, system architecture and advanced DSP techniques.
Contribution to photonixFAB
Within the photonixFAB project, NOKIA is responsible for the specification, assembly and performance evaluation of the silicon photonics demonstrators for telecom coherent transceiver applications. It is also NOKIA's role to provide information on the state of the art and future requirements for photonic applications.
NVIDIA
NVIDIA’s invention of the GPU (graphics processing unit) in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.
NVIDIA accelerated networking solutions, featuring NVIDIA Quantum InfiniBand and Spectrum Ethernet Platforms, gives enterprises infrastructure flexibility to support develop-to-deploy implementations across all modern workloads and storage requirements that enable a new era of accelerated computing to maximize AI investments.
Contribution to photonixFAB
NVIDIA is responsible for testing the photonixFAB technology as an end user. The company will use the photonixFAB platform to generate layouts for transceivers and optical switches and will evaluate the demonstrators on its testbed.
PHIX Photonics Assembly
PHIX is a world leading packaging and assembly foundry for Photonic Integrated Circuits (PICs), building optoelectronic modules based on all major PIC technology platforms in scalable manufacturing volumes. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC assembly.
Contribution to photonixFAB
Within photonixFAB, PHIX is leading the development of scalable and cost-effective industrial packaging of hybrid photonic integrated modules and subsystems based on silicon-on-insulator and silicon nitride platform, including methods for photonic-electronic co-assembly. Furthermore, PHIX is contributing to the development of an Assembly Design Kit (ADK) and of the photonixFAB ecosystem as a whole.
PhotonFirst
PhotonFirst is a pioneer in next-generation smart sensing technologies. Since 2006, PhotonFirst is unlocking the power of the photon to measure temperature, strain, pressure and shape. We support our customers to develop new or improved (better, faster, cheaper, more efficient) photonics sensing solutions and have everything needed in-house to industrialize, produce, scale, certify, supply and service these subsequently. We use PIC technology at the core of our measurement systems for FBG-based sensing, that allows us to deliver reliable, scalable, and affordable products that enable a paradigm shift in the fiber optic sensing world.
Contribution to photonixFAB
In photonixFAB, PhotonFirst is responsible for the packaging, verification and validation of the integrated photonic assembly for the fiber sensing demonstrator. We participate in the definition of requirements for the platforms, integration and interfaces of the photonic components, and verify the performance w.r.t. product and module need in function and product manufacturability.
SMART Photonics
SMART Photonics provides pure-play Indium Phosphide (InP) foundry services for multiple photonics markets. Their facility in Eindhoven offers full (4-inch) wafer processing services from base epitaxial growth to back-end processing, including thinning and die-singulation. SMART has unique and world-leading experience in the design and manufacture of monolithically integrated InP PICs. The company enables customers to design their own PIC designs for manufacture through SMART's PDK, comprising well-characterized building blocks involving both active (SOAs, modulators and detectors) and passive (low loss waveguides, splitters, AWGs) components.
Contribution to photonixFAB
Within the photonixFAB project, SMART will develop a Micro-Transfer Printing (μTP) technology in conjunction with consortium partners. This will provide a scalable route to the high-volume integration of InP components including both active (SOAs, modulators and detectors) and passive (low loss waveguides, splitters, AWGs) elements into Silicon Photonics (SiPh) platforms (SOI and SiN), enabling the realisation of complex SiPh PICs. SMART will develop a specially adapted heterogeneous PDK, which will include μTP-specific features for each BB that facilitates the InP integration process. Customers will be able to access such InP chip designs through the PDK of SiPh partners, enabling customers to design, manufacture and test novel SiPh PICs that include active and passive InP components.
Thales
Thales is one of the world’s major players in civilian and professional electronics with more than 77,000 employees, a global presence in 68 countries, and a turnover of 17.6 B€ in 2022. Thales Research and Technology France (TRT), located in Palaiseau near Paris, is the main multidisciplinary research unit of the Thales Group. With one Nobel Prize, three European Research Council projects and 80 French or European collaborative research projects in progress, 240 permanent employees and 40 PhD students, 4,000 m² of cleanroom space and 200 major characterization and process instruments, TRT contributes to the preparation of Thales' industrial future in strategic R&D fields. TRT is dedicated to mastering increasingly sophisticated technologies, particularly those related to detection, analysis, or decision making, in order to design and develop critical information systems. These innovative solutions serve clients in various domains such as secure communications, space systems, air traffic management, embedded electronics, large-scale computer networks, and public administration.
Contribution to photonixFAB
Thales, as an application partner, is responsible for defining the specifications of the silicon photonics demonstrators for coherent sensor applications. Thales will contribute to the PIC design and evaluate the performance of the demonstrator on a dedicated distributed coherent fiber sensor test bench.
X-FAB Group
X-FAB is the leading analog/mixed-signal and specialty foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special silicon carbide and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,200 people worldwide.
Contribution to photonixFAB
As part of the photonixFAB project, an installation of imec’s SOI platform into X-FAB’s 200 mm high-volume fab is planned. X-FAB will also enable early technology access and offer prototyping runs . In addition, the SOI platform will be readied for heterogenous integration (micro transfer printing) of high-performance materials like InP and LNO.