Enabling early technology access
This page provides an access point for you to learn about the different capabilities offered by the respective members of the photonixFAB consortium. You can explore the technologies and services that are already available and select the technology/service of interest in the contact form through which your inquiry will then be directed to the relevant partners.
SiN Process Technology
LIGENTEC’s silicon nitride technology enables products based on integrated photonics and allows companies and research institutions to fabricate their own designs.
LIGENTEC offers a foundry service for our low loss silicon nitride integrated photonics platform which results in best-in-class passive devices. LIGENTEC is able to support customers from concept design and layout studies including building block design through fabrication up to testing the PICs and provides guidance in the packaging process to obtain a successful product.
In addition, LIGENTEC develops the integration of active components such as thin film lithium niobate (TFLN) to enable high speed modulation and photodiodes for light detection. Silicon Nitride is an excellent platform for guiding the light and using the established PDK.
| Technology | PDK | MPW | Offering | Application |
|---|---|---|---|---|
| MPW AN800 |
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From prototyping to high volume production | High confinement, C-band, frequency combs |
| MPW AN350 |
|
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From prototyping to high volume production | Multi-purpose, O-band, NIR |
| MPW AN150 |
|
|
Prototyping; high volume in preparation | Sensing, VIS |
LIGENTEC process offers a state-of-the-art platform with very high geometric accuracy. The process is accompanied by a complete Process Design Kit (PDK, available in L-edit, Calibre, Luceda and Synopsys). The PDK includes Design Rule Checks (DRC) and validated reference designs. Benefits of using the LIGENTEC’s SiN platform include:
- Very low optical propagation loss (down to <1dB / m in C-band)
- Coupling to single mode fiber (<1dB / facet)
- Efficient thermal phase tuning (pi-shift < 15 mW)
- High confinement ring resonators (Q factors >20M)
- Variety of application-specific technology stacks
- Comprehensive PDK
- Statistical process control
- Established in a high-volume 200 mm foundry (automotive qualified)
A unique feature of the thick waveguides is their anomalous dispersion and their high damage threshold that is important in a range of nonlinear optical applications, including integrated quantum communication, supercontinuum generation in waveguides from pulsed lasers, femtosecond pulse generation from CW lasers using soliton generation in microresonators. The high-power threshold enables applications such as LIDAR to propagate Watts of power in the waveguides. In addition, the transparency window in the visible renders silicon nitride planar photonic circuits attractive for microfluidics and bio-sensing applications.
All Nitride (AN) technology is named because most of the mode (>90%) is in the nitride waveguide. The high mode confinement:
- Extends the transparency window to 3.0 µm in the MIR
- Reduces the bending radius, making very compact design possible
- Gives access to non-linear and quantum option through waveguide design
- Can operate in very high power with/without non-linear effects
- Reduced the propagation losses
LIGENTEC offers its proprietary silicon nitride (Si3N4) platform targeted at photonic applications using integrated photonic chips from visible to mid-IR spectrum. Silicon nitride as a material strikes a balance between silicon and silicon oxide.
LIGENTEC is developing cutting-edge technology to integrate novel, high performance materials on top of our state-of-the-art silicon nitride platform. One of the key materials is the integration of thin-film lithium niobate (TFLN) on SiN, also called lithium niobate on insulator or LNOI. This creates a platform that will transform the world of photonics by combining the best passive photonics platform with an exceptional electro-optical material platform.
MPW: Multi-Project Wafer Runs
LIGENTEC enables you an easy way to access our All-Nitride core technology for photonic integrated circuits through the Multi-Project Wafer (MPW) service and offers a low-entry barrier to test the low-loss technology. After tape-out, LIGENTEC will perform a DRC check on your design, and you will have time to provide a DRC free design.
This MPW service is provided on a regular basis (e.g. typically every other month) and is particularly interesting for getting a taste of AN technology and to run a first feasibility.
More information on Ligentec's offering can be found here: https://www.ligentec.com/offering/
SOI Process Technology
The SOI process technology is readily available through imec for prototyping and small production series. It will become available through X-FAB’s high-volume EU-based fab during the course of 2025. Early adopters can initiate their projects already today and will then be able to port their designs into the high-volume fab.
With a state-of-the-art integrated silicon photonics platform, imec is your ideal development partner in realizing your applications from telecom and datacom to sensing.
Currently, imec offers its silicon on isolator (SOI) platform iSiPP50G to multiple partners at fixed tape-in dates through multi-project wafer (MPW) runs. SMEs, universities, and other users can affordably manufacture small batches of photonics integrated chips (PICs) by sharing masking and processing costs.
The iSiPP50G platform offers excellent performance, design flexibility and unrivalled critical dimension and thickness control. It is a mature process technology (130nm) with a proven device library.
Imec offers also a dedicated and flexible silicon photonics prototyping service specifically tuned to the needs of a single partner, on both 200mm and 300mm wafers (referred to as iSiPP200(N) and iSiPP300). This service extends the iSiPP50G offering with process customization options.
| Technolgy | Accessibility | Wafer size | Features |
|---|---|---|---|
| imec SiP Passives+ |
MPW runs |
200 mm | • Passive components • Metal-based heater |
| iSiPP50G |
MPW runs |
200 mm | Standard Passives+ extended with active components: • Electro-optic modulators • Electro-absorption modulators • Ge photodetectors |
The Silicon Photonics MPW offer from imec includes the following platforms:
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Based on (220nm silicon/2000nm buried oxide) SOI wafers, it combines passive components with metal-based heater for thermal tuning.
The key features of the Passives+ platforms are:
- Three etching depths in SOI layer to allow the desire combination of different photonic functions.
- Option to expose waveguides by removing oxide from the top of the waveguides.
- A patterned poly-silicon layer optimizes the performance of grating couplers.
- Broadband edge couplers
- Multimode interferometers
- Thermal tuning using metal-based heaters.
- Metal-based phase shifters.
- Two levels of metal interconnects and aluminium finish metallization.
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Based on (220nm silicon/2000nm buried oxide) SOI wafers, it co-integrates various passive and active 50Gbd components in a single platform to support a wide range of optical transceiver architectures.
iSiPP50G is a superset of Passives+ technology, it includes all the passive components that are part of the Passives+ offer. In addition to that iSiPP50G platform includes doped Silicon and Germanium modules which allow it to provide the following active components:
- Thermo-optic phase shifters
- Electro-optic modulators (Mach-Zehnder modulators, Ring modulators)
- Silicon-germanium electro-absorption modulators
- Germanium photodetectors (monitor photodetectors, the high-bandwidth photodetectors)
imec's ISIPP50G platform 
Available building blocks in ISIPP50G
Imec provides an extensive iSiPP50G Process Design Kit (PDK) which is supported by various EDA tools. This kit includes documentation for the process, library performance details, design, and verification rules. The PDK is available upon signature of imec’s Silicon Photonics Design Kit License Agreement (DKLA).
The MPW runs are accessible via EUROPRACTICE where imec is one of the partners.
More information on imec's offering can be found here: https://www.imeciclink.com/en/asic-fabrication/si
InP Process Technology
InP technology plays a vital role within the photonics industry as the key enabler of light emission in the commercially-important wavelength range for telecom/datacom from 1200 nm to 1650 nm.
As such, InP-based lasers, amplifiers, photodetectors and modulators have been widely deployed in a range of applications including high-speed communications, sensing, spectroscopy, defense and health care.
The global market for InP die forecast to be worth $3.5 billion in 2024, growing to over $5 billion by the end of 2026.
| Module/Chiplet | Function | Performance |
|---|---|---|
| SOA | Amplification of optical signals | Small Signal Gain 1-25 dB/mm Saturation Power 15-16 dBm Noise Figure < 6dB |
| DBR laser | Single-frequency lasing | Output Power 6-10 dBm SMSR 30 dB |
| UTC photodetector | High speed detection of optical signals | Responsivity 0.7A/W 3dB Bandwidth 30-40 GHz Dark Current < 200 NA at -2V |
| CPS modulator | High frequency modulation of optical signals | 3dB Bandwidth 40-50 GHz Extinction Ratio >20 dB Vπ <5 V |
SMART Photonics provides InP foundry services from its facility in Eindhoven and has a proven track record in the supply of high-performance InP photonics chips. It has developed unique capabilities to manufacture monolithically integrated InP photonic integrated circuits (PICs) in which multiple photonic functionalities can be integrated on a single InP chip as shown below. This provides the opportunity to deliver complex PICs with significant performance benefits.
SMART’s InP production facility provides a full 4-inch InP manufacturing processes capability from epitaxial growth to die singulation.
SMART can provide access to its PDK through MPW runs which can be joined every two months and provides subscribers with the opportunity to carry-out initial proof-of-concept studies and evaluate a given InP PIC design at a fraction of the cost of a dedicated full 4-inch wafer.
As part of the photonixFab project, SMART will enable the use of its established and well-characterized InP building blocks in SiPh PICs to provide optical emission and amplification capabilities that could not otherwise be realised. They will also provide complimentary capabilities for optical detection and modulation using the relevant InP building blocks from its library. These InP components will be integrated in SiPh PICs using a micro-transfer printing (µTP) capability which will be developed and optimised within the project and will provide considerable benefits over incumbent integration schemes in terms of scalability and high-volume manufacturing. PIC designers will be able to access a heterogeneous version of SMART’s PDK which will comprise µTP -compatible versions of its existing building blocks enabling the integration of both discrete InP components and InP PICs.
Packaging
A photonic integrated circuit (PIC) by itself is not a functional product yet. In order to make it become part of a photonics-enabled device, the chip needs to be connected to components like optical fibers, other PICs, cooling solutions, and electronics. The design and manufacturing of the package in which these connections are made is the core business of PHIX.
PHIX builds optoelectronic modules based on all major PIC technology platforms (such as indium phosphide, silicon photonics, silicon nitride, and planar lightwave circuit) in scalable manufacturing volumes. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC assembly.
| Product/Service | Description |
|---|---|
| Prototype packaging | PIC packaging solutions that allow for convenient, quick and affordable characterization and prototyping of your first chips. They provide a housing with electrical connections, optical interfaces, and thermal management. |
| Volume packaging | We provide a scale-up path for your PIC-based device that optimally balances performance with cost and manufacturability. |
| Contract manufacturing | If you’re looking to outsource or second-source (steps of) the production of your PIC-enabled modules, we can run your manufacturing processes on our machines, with functions ranging from wafer dicing to hybrid assembly. |
| Fiber arrays | We provide high-performance single mode and polarization maintaining fiber arrays with options for attached spot size converters or 3D-printed microlenses. |
| 3D microfabrication | We can 3D print optical and mechanical microstructures directly onto fibers or PIC surfaces, using a high-precision additive process based on two-photon polymerization (2PP). |
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PHIX provides packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported.
We encourage the choice for a standard housing. Each of these have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
PHIX Characterization Package (supporting PICs of various sizes and material platforms) -
Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for various markets and applications. We support all major material platforms, such as silicon photonics, silicon nitride, indium phosphide and planar lightwave circuit, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.
Hybrid tunable laser modules (manufactured in volume) -
If you’re looking to outsource or second-source (steps of) the production of your PIC-enabled modules, PHIX is your perfect partner. We can run your manufacturing processes on our machines, with functions ranging from wafer dicing to hybrid assembly.
Our team of highly experienced engineers can oversee the process transfer that implements your processes on our machines.
Automated equipment for hybrid assembly of PICs using active alignment -
PHIX offers a broad range of high-quality v–groove optical fiber arrays for PIC connections. Our offering covers the wavelength range from ultraviolet to infrared, channel counts up to 64, and various pitches and polishing angles. In addition, we have options for attaching spot size converters or 3D printing microlenses on the fiber ends.
Optical fiber array with high-precision microlenses 3D printed on the fiber ends -
We can 3D print optical and mechanical microstructures directly onto surfaces such as fiber cores or photonic integrated circuits (PICs). Some example applications are:
- Lensed fiber arrays
- (Arrays of) microlenses on PIC surfaces or edges
- Prisms or other freeform optical structures
- Microfluidic or micromechanical structures
Microlens array printed on the surface of a PIC
Heterogeneous Integration
3D integration is used to enhance the performance of photonic SiN or SOI based systems. In addition, heterogeneous integration of chiplets that originate from different technologies such as InP offers multiple opportunities to design novel applications. Micro-Transfer-Printing is a suitable fabrication technique for stacking ultra-thin chiplets with very high precision. The technique uses a soft and sticky stamp to release chiplets from a source wafer and place them on a target wafer or any other material as flexible substrates. After placement, the printed chiplets can be electrically connected by a Cu/Au redistribution layer and protected by a passivation layer.
Benefits of Micro-Transfer-Printing
| Feature | Benefit |
|---|---|
| Mass transfer | 100, 1,000 or more chiplets are printed at once |
| Heterogeneous integration | Different source wafers can be used for a single target |
| Effective source utilization | Chiplets are rearranged on the target |
| High placement accuracy | 0.5 µm and better can be achieved |
| Short metallization tracks | Enable small parasitics (RC) |
| Small & thin devices | Supporting smallest dimensions for Advanced Packaging |
Micro-Transfer-Printing (µTP) is an approach for the heterogeneous integration of microscale electronic devices on non-native substrates by means of stamp pick-up and printing procedures. Therefore, so called chiplets are released from a source wafer and attached to target wafer. Since large amounts of chiplets can be transferred simultaneously, µTP is a highly efficient process. With its superior alignment accuracy, µTP offers solutions for System-in-Package integration of CMOS, MEMS, wide-bandgap and photonic devices. Advantages of µTP are even more pronounced if:
- different chiplet variants are printed on one target wafer,
- printed chiplets are much smaller than the chip size on the target wafer or
- the source wafer material (chiplet) is expensive.
Printed chiplets are electrically connected by a copper or a gold redistribution layer before a passivation layer is deposited for protection.
Beside printing and related processes, X-FAB offers source wafer fabrication for CMOS wafers originating from 180 nm BCD-on-SOI platform technology. To obtain print-ready CMOS chiplets, the following processes are performed using finished CMOS wafers:
Pad Protection
Pads are deposited with a noble metal protection layer.
Chiplet Singulation Ion etching down to the BOX layer enables trenches between neighboring chips.
Tether FormationDefined SiN structures to omit chiplets floating around after release etch.
Release EtchSilicon handle wafer is selectively etched to generate free-standing, print-ready chiplets.
The print-ready source wafer fabrication can be adapted to different substrates and varied material systems. In photonixFAB, project partners develop print-ready source wafers based on a InP PIC platform. Therefore, powerful LASER and SOAs can be integrated into passive SOI and SiN PIC platforms using µTP. Very high alignment accuracies, printing into wafer cavities and applying thinnest adhesion layers enable optical coupling efficiencies needed to develop state-of-the-art devices.
In addition to efficient light sources heterogeneously integrated in SOI and SiN PIC platforms, the formation of high-frequency modulators also extends the field of application. For this purpose, LiNbO3 (LNO) chiplets are integrated by µTP to develop novel photonic integrated devices.
Using µTP, heterogeneously integrated chiplets extend the capabilities of SOI and SiN PIC platforms at an affordable effort. In addition to photonics, advanced sensor, RF, LED or VCSEL technologies supporting complex systems can also benefit from the use of print-ready source wafers and µTP. Therefore, chiplets composed of III/V semiconductors such as GaAs, GaN, InAs, AlN and others are typical candidates for µTP to enhance performance density for a variety of technologies.
A broad range of production processes are required to offer print-ready CMOS chiplets and Micro-Transfer Printing as such. Therefore, X-FAB offers wafer-level processes for the deposition of insulating and conductive materials. In addition to all types of photolithographic processing technologies, dry and wet chemical etching can also be applied at wafer level. All of the above processes are available on one site to support an industrial pilot line for Micro-Transfer Printing.
EDA Solution
Luceda Photonics offers a comprehensive PIC design flow which empowers photonics IC designers to easily bring their PIC design ideas to life and reduce time to market. Through a code-based approach, the Luceda Photonics Design Platform, helps PIC designers to quickly achieve their tape-out and get their designs right the first time, by automating and integrating all aspects of the photonic design flow in one platform and using one standard language. Our design platform enables PIC designers to design PICs with a schematic capture with code assistance, simulate and optimize the PICs by enhancing the reliability of the designs with functional verification. Moreover, we offer access to a wide range of PDKs worldwide and help our customers create manufacturable designs that they can tape out to their foundry of choice.
| Module | Features |
|---|---|
| IPKISS |
Full PIC design tool combining layout, simulation engine and tape-out: PDK definition |
| IP Manager | Design IP management – regression testing |
| AWG Designer | Synthesis, layout and simulation of Arrayed Waveguide Grating Devices |
| Links | Link for Ansys Lumerical (FDTD and MODE) Link for Dassault Systems Simulia Link for Siemens EDA (L-Edit) |
| PDKs | Design Kits for >20 foundries (SOI, SiN, InP, LNOI, AlOx,…) |
| Services | Advanced software and application engineering services |
Luceda Photonics Design Platform offers:
- Circuit design, layout & simulation (transient and frequency domain)
- Component design, layout & simulation
- Optical and electrical routing
- Schematic capture with code assistance
- Data-driven compact models
- Functional verification
- Design IP management and design kit quality assurance
- Design validation
- Tape-out preparation
- PDK enablement
