Technologies & Services

Enabling early technology access

This page provides an access point for you to learn about the different capabilities offered by the respective members of the photonixFAB consortium. You can explore the technologies and services that are already available and select the technology/service of interest in the contact form through which your inquiry will then be directed to the relevant partners.





Heterogeneous Integration


SiN Process Technology

LIGENTEC’s silicon nitride technology enables products based on integrated photonics and allows companies and research institutions to fabricate their own designs.

LIGENTEC offers a foundry service for our low loss silicon nitride integrated photonics platform which results in best-in-class passive devices. LIGENTEC is able to support customers from concept design and layout studies including building block design through fabrication up to testing the PICs and provides guidance in the packaging process to obtain a successful product.

In addition, LIGENTEC develops the integration of active components such as thin film lithium niobate (TFLN) to enable high speed modulation and photodiodes for light detection. Silicon Nitride is an excellent platform for guiding the light and using the established PDK. 

SOI Process Technology

The SOI process technology is readily available through imec for prototyping and small production series. It will become available through X-FAB’s high-volume EU-based fab during the course of 2025. Early adopters can initiate their projects already today and will then be able to port their designs into the high-volume fab. 

With a state-of-the-art integrated silicon photonics platform, imec is your ideal development partner in realizing your applications from telecom and datacom to sensing.

Currently, imec offers its silicon on isolator (SOI) platform iSiPP50G to multiple partners at fixed tape-in dates through multi-project wafer (MPW) runs. SMEs, universities, and other users can affordably manufacture small batches of photonics integrated chips (PICs) by sharing masking and processing costs.

The iSiPP50G platform offers excellent performance, design flexibility and unrivalled critical dimension and thickness control. It is a mature process technology (130nm) with a proven device library.

Imec offers also a dedicated and flexible silicon photonics prototyping service specifically tuned to the needs of a single partner, on both 200mm and 300mm wafers (referred to as iSiPP200(N) and iSiPP300). This service extends the iSiPP50G offering with process customization options.

InP Process Technology

InP technology plays a vital role within the photonics industry as the key enabler of light emission in the commercially-important wavelength range for telecom/datacom from 1200 nm to 1650 nm.

As such, InP-based lasers, amplifiers, photodetectors and modulators have been widely deployed in a range of applications including high-speed communications, sensing, spectroscopy, defense and health care.
The global market for InP die forecast to be worth $3.5 billion in 2024, growing to over $5 billion by the end of 2026.


A photonic integrated circuit (PIC) by itself is not a functional product yet. In order to make it become part of a photonics-enabled device, the chip needs to be connected to components like optical fibers, other PICs, cooling solutions, and electronics. The design and manufacturing of the package in which these connections are made is the core business of PHIX.

PHIX builds optoelectronic modules based on all major PIC technology platforms (such as indium phosphide, silicon photonics, silicon nitride, and planar lightwave circuit) in scalable manufacturing volumes. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC assembly.

Heterogeneous Integration

3D integration is used to enhance the performance of photonic SiN or SOI based systems. In addition, heterogeneous integration of chiplets that originate from different technologies such as InP offers multiple opportunities to design novel applications. Micro-Transfer-Printing is a suitable fabrication technique for stacking ultra-thin chiplets with very high precision. The technique uses a soft and sticky stamp to release chiplets from a source wafer and place them on a target wafer or any other material as flexible substrates. After placement, the printed chiplets can be electrically connected by a Cu/Au redistribution layer and protected by a passivation layer.

EDA Solution

Luceda Photonics offers a comprehensive PIC design flow which empowers photonics IC designers to easily bring their PIC design ideas to life and reduce time to market. Through a code-based approach, the Luceda Photonics Design Platform, helps PIC designers to quickly achieve their tape-out and get their designs right the first time, by automating and integrating all aspects of the photonic design flow in one platform and using one standard language. Our design platform enables PIC designers to design PICs with a schematic capture with code assistance, simulate and optimize the PICs by enhancing the reliability of the designs with functional verification. Moreover, we offer access to a wide range of PDKs worldwide and help our customers create manufacturable designs that they can tape out to their foundry of choice.